Manufacturing Capability:
Types of Assembly: SMT (Surface-Mount Technology); THD (Thru-Hole Device); SMT &THD mixed  

1)SMT production: 3 complete automatic SMT production lines, populating 6 million dots per day;

2)DIP workshop: 2 DIP production line: 190 000 points / day; Plug-in lines; Wave soldering furnace;

3)Manual welding: 1 hand welding lines;

4) Programming & Testing.

5)Components Package:01005, 0201, 0402,0603,0805,1206,2512, QFP,QFN,CSP,TSOP,SOJ,BGA,uBGA,etc

6)Board type: Rigid, Flexible, rigid&Flexible.

7)PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2;

8)PCB thickness: 0.2mm-7.0mm;

9)PCB dimension: 50*50mm-500*500mm;

10)Copper thickness: Min:0.5oz; Max: 5.0oz;

11)Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm;

12)Component size: 0.6*0.3mm-33.5*33.5mm;

13)Component height: 6mm(max);

14)Pin spacing laser recognition over 0.65mm;

15)High resolution VCS 0.25mm;

16)BGA spherical distance: ≥0.25mm;

17)BGA Globe distance: ≥0.25mm;

18)BGA ball diameter: ≥0.1mm;

19)IC foot distance: ≥0.2mm;

Testing Procedures

• Visual inspection: general quality check.
• X-ray Inspection: checks for BGAs, QFN and bare circuit boards.
• AOI Testing: checks for solder paste, 0201 components, missing components and polarity.
• ICT (In-Circuit Test).
• Functional test (Following your test procedures and methods).
   

• Bill of material, complete information in excel format. It includes manufacturers' name, part number, reference designators, components description and quantities.
• Complete Gerber files
• PCB requirements(board thickness, copper thickness, surface finishing, solder mask color, etc)
• Pick and place data
• Other requirements such as special packing or assembly instructions, pictures if applicable.
• QTY